description ? halogen free ? 165c maximum total temperature operation ? 7.6x7.0x3.0mm maximum surface mount package ? magnetically shielded ? rugged construction ? handles high transient inrush current spikes ? inductance range from 1.5h to 8.2h ? current range from 3.5 to 17.5 amps ? rohs compliant high frequency, high current power inductors mpa7030 series 0611 bu-sb11644 page 1 of 5 data sheet: 4421 smd device 1. open circuit inductance (ocl) test parameters: 100khz, 0.25v rms , 0.0adc 2. i rms 1: dc current for an approximate temperature rise of 40c without core loss at 85c ambient temperature. derating is necessary for ac currents. pcb layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. it is recommended that the temperature of the part not exceed 165c under worst case operating conditions verified in the end application. 3. i rms 2: dc current rating for for 125c ambient tempera ture operation. derating is necessary for ac currents. pcb layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. it is recommended that the temperature of the part not exceed 165c under worst case operating conditions verified in the end application. 4. i sat : peak current for approximately 20% rolloff at +25c (8r2 = 30%). 5. k-factor: used to determine b p-p for core loss (see graph). b p-p = k * l * i. b p-p : (gauss), k: (k-factor from table), l: (inductance in h), i (peak-to-peak ripple current in amps). 6. part number definition: mpa7030-xxx-r - mpa7030 = product code and size - xxx= inductance value in h, r = decimal point. if no ?r? is present, then third digit equals the number of zeros. - ?-r? suffix = rohs compliant product specifications part ocl 1 i rms1 2 i rms2 3 i sat 4 srf (mhz) dcr (m ) dcr (m ) number 6 20% ( h) (amps) (amps) (amps) minimum @20c typical @20c maximum k-factor 5 MPA7030-1R5-R 1.5 9.20 7.60 17.5 37 13.5 14.9 174.6 mpa7030-2r2-r 2.2 7.70 6.30 11.0 28 19.6 22.0 145.8 mpa7030-3r3-r 3.3 6.20 5.40 11.0 19 26.0 28.1 124.7 mpa7030-4r7-r 4.7 5.50 4.70 9.50 15 36.5 40.0 104.8 mpa7030-6r8-r 6.8 4.50 3.80 7.50 12 55.0 60.5 84.4 mpa7030-8r2-r 8.2 4.00 3.50 8.00 10 64.5 71.0 74.8 pb halogen hf free applications ? automotive electronics (under the hood, interior/exterior) ? voltage regulator module (vrm) ? multi-phase regulators ? point-of-load modules ? desktop and server vrms and evrds ? base station equipment ? notebook regulators ? pol converters ? battery power systems ? data networking and storage ? graphics cards ? lcd displays, led drivers environmental data ? storage temperature range: -55c to +165c ? operating temperature range: -55c to +165c (ambient + self-temperature rise) ? solder reflow temperature: j-std-020d compliant ? complies with aec-q200 standard packaging ? supplied in tape and reel packaging, 1500 parts per 13? reel
supplied in tape and reel packaging, 1500 parts per 13? diameter reel. packaging information - mm 0611 bu-sb11644 page 2 of 5 data sheet: 4421 dimensions - mm 7.8
temperature rise vs. total loss core loss 0 10 20 30 40 50 60 70 80 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 temperature rise (c) total loss (w) 0611 bu-sb11644 page 3 of 5 data sheet: 4421 0.001 0.01 0.1 1 10 100 1000 10000 core loss (w) b p-p (gauss) core loss vs. b p-p
0611 bu-sb11644 page 4 of 5 data sheet: 4421 inductance characteristics - % of ocl vs. i dc 40% 50% 60% 70% 80% 90% 100% 0 2 4 6 8 10 12 14 16 18 20 22 % of ocl i dc (amps) MPA7030-1R5-R 40% 50% 60% 70% 80% 90% 100% 0246810121416 % of ocl i dc (amps) mpa7030-2r2-r 40% 50% 60% 70% 80% 90% 100% 02468101214 % of ocl i dc (amps) mpa7030-3r3-r 40% 50% 60% 70% 80% 90% 100% 02468101214 % of ocl i dc (amps) mpa7030-4r7-r 40% 50% 60% 70% 80% 90% 100% 024681012 % of ocl i dc (amps) mpa7030-6r8-r 40% 50% 60% 70% 80% 90% 100% 024681012 % of ocl i dc (amps) mpa7030-8r2-r
? 2011 cooper bussmann www.cooperbussmann.com 0611 bu-sb11644 page 5 of 5 data sheet: 4421 the only controlled copy of this data sheet is the electronic read-only version located on the cooper bussmann network drive. a ll other copies of this document are by definition uncon- trolled. this bulletin is intended to clearly present comprehensive product data and provide technical information that will he lp the end user with design applications. cooper bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution o f any products. cooper bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. once a product has been selected, it sh ould be tested by the user in all possible applications. life support policy: cooper bussmann does not authorize the use of any of its products for use in life support devices or syste ms without the express written approval of an officer of the company. life support systems are devices which support or sustain life, and whose failure to perform, when properly used in ac cordance with instructions for use provided in the label- ing, can be reasonably expected to result in significant injury to the user. north america cooper electronic technologies 1225 broken sound parkway nw suite f boca raton, fl 33487-3533 tel: 1-561-998-4100 fax: 1-561-241-6640 toll free: 1-888-414-2645 cooper bussmann p.o. box 14460 st. louis, mo 63178-4460 tel: 1-636-394-2877 fax: 1-636-527-1607 europe cooper electronic technologies cooper (uk) limited burton-on-the-wolds leicestershire ? le12 5th uk tel: +44 (0) 1509 882 737 fax: +44 (0) 1509 882 786 cooper electronic technologies avda. santa eulalia, 290 08223 terrassa, (barcelona), spain tel: +34 937 362 812 +34 937 362 813 fax: +34 937 362 719 asia pacific cooper electronic technologies 1 jalan kilang timor #06-01 pacific tech centre singapore 159303 tel: +65 278 6151 fax: +65 270 4160 solder reflow profile temperature t t p t s t c -5c time 25c to peak time 25c t smin t smax t l t p preheat a max. ramp up rate = 3c/s max. ramp down rate = 6c/s t t a a b b l l e e 1 1 - - s s t t a a n n d d a a r r d d s s n n p p b b s s o o l l d d e e r r ( ( t t c c ) ) vol u me vol u me packa g emm 3 mm 3 thickne ss <350 > _ 350 <2.5mm 235 c 220 c > _ 2.5mm 220 c 220 c t t a a b b l l e e 2 2 - - l l e e a a d d ( ( p p b b ) ) f f r r e e e e s s o o l l d d e e r r ( ( t t c c ) ) vol u me vol u me vol u me packa g emm 3 mm 3 mm 3 thickne ss <350 350 - 2000 >2000 <1. 6 mm 2 6 0 c 2 6 0 c 2 6 0 c 1. 6 ? 2.5mm 2 6 0 c 250 c 245 c >2.5mm 250 c 245 c 245 c reference jdec j-std-020d profile feat u re s tan d ar d s np b s ol d er lea d (p b ) free s ol d er pr e h ea t a n d s o a k? t e mp e r a tur e min. (t smin ) 100 c 150 c ? t e mp e r a tur e m a x. (t sm a x ) 150 c 200 c ? tim e (t smin to t sm a x ) (t s ) 6 0-120 se con d s 6 0-120 se con d s a v e r a g e r a mp up r a t e t sm a x to t p 3 c / se con d m a x. 3 c / se con d m a x. liqui d ous t e mp e r a tur e (t l ) 183 c 217 c tim e a t liqui d ous (t l ) 6 0-150 se con d s 6 0-150 se con d s p ea k p a ck a g e b o d y t e mp e r a tur e (t p ) * t ab l e 1t ab l e 2 tim e (t p ) ** within 5 c of th e sp e cifi ed cl a ssific a tion t e mp e r a tur e (t c ) 20 se con d s ** 30 se con d s ** a v e r a g e r a mp- d own r a t e (t p to t sm a x ) 6 c / se con d m a x. 6 c / se con d m a x. tim e 25 c to p ea k t e mp e r a tur e6 minut e s m a x. 8 minut e s m a x. * tol e r a nc e for p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum. ** tol e r a nc e for tim e a t p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum.
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